Several critical processes address wafer flatness, wafer edge defects and flatness to enable bonded wafer stacks.

Samsung Electronics reportedly plans to restructure its Semiconductor Research Institute, transferring the DRAM and NAND ...

Under CEO Pat Gelsinger's watch, Intel is on track to deliver five process nodes in four year as all eyes are on its foundry ...

Enabling these transfer rates is a new memory standard called CUDIMM (Clocked Unbuffered Dual Inline Memory Module), which ...

With strong backing from the Chinese government, Changxin Memory Technologies (CXMT) is aggressively expanding its DRAM ...

Intel, once the world’s leader in both designing and supplying advanced chips, has decided to spin off its chip manufacturing ...